As AI, HPC, and heterogeneous integration architectures gain rapid adoption, TSMC is accelerating adjustments to its manufacturing plans. According to Commercial Times, industry sources say TSMC is evaluating a reallocation of part of its 40nm–90nm mature-node capacity, which could be redirected t...

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips directly onto PCB mainboards via mSAP processes, skipping IC substrates entirely. However, Info...