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China\'s Aggressive Push for High-End AI Chip Autonomy
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[News] Sandisk Reportedly Tapes Out First HBF Product, Targets 2027 Samples and 2028 Production
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[News] Huawei Reportedly Readies Mate 90, XT2 for Sept. with Tau Scaling Chips Said to Match 3nm Performance
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[News] AI Agents Enter Chipmaking: SK hynix Tests Back-End Deployment; Samsung Cuts SoC Verification to 2 Days

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    2026-08-18

    [News] NVIDIA Vera Rubin Spillover from HBM to NAND: CMX Fuels TLC Spot Price Rebound from June Dip

    Semiconductors

    As NVIDIA’s Vera Rubin ramps up, its memory impact is extending beyond HBM into NAND. Alpha Economy reports that stronger Rubin production is tightening TLC NAND supply-demand, with the 512Gb TLC NAND spot price rebounding from its June dip to $21.125 on Aug. 17. Citing DRAMeXchange, the report...

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