According to Economic Daily News, on the 21st, international gold prices surged to a new record high of USD 3,400 per ounce. Due to the heavy use of gold as a raw material in the gold bumping process for panel driver IC packaging, Taiwan’s two major driver IC packaging and testing companies, Chipb...

Leading driver IC OSAT company Chipbond and major foundry UMC announced on September 3 that the two companies established a strategic partnership via a stock swap, through which UMC (and its subsidiary UMC Capital) will hold 9.09% of Chipbond’s equity, while Chipbond will hold 0.62% of UMC’s equ...