Subject


China


2025-11-20

[News] China Developed World’s First Wafer-Scale 2D Semiconductor FPGA

Recently, a joint research team from Fudan University and Shaoxin Lab, led by Zhou Peng and Bao Wenzhong, has achieved another globally leading breakthrough in 2D semiconductor integrated circuit — the development of the world’s first field-programmable gate array (FPGA) fabricated using wafer-s...

2025-11-19

[News] Huawei-Related Firms Spur China’s Chip Buildout Across Materials, Photoresist, and EDA

As China doubles down on technological independence, Huawei and its ecosystem of partners have been pivotal to the effort. According to Nikkei, after U.S. sanctions the company in 2019, Huawei set up investment arms, including wholly owned subsidiary Hubble, to back more than 60 semiconductor compan...

2025-11-07

[Insights] China’s Chip Equipment Industry Rides 2025 IPO Wave to Boost Localization

Alongside acquisitions and support from national funds, China’s chip equipment sector has also welcomed a wave of new IPOs this year. In the testing equipment segment, Sidea Semiconductor Equipment was successfully listed on the Shenzhen Stock Exchange on March 24. The company focuses on developin...

2025-11-05

[News] China’s Big Fund Phase III Invested in Lithographic Material Related Company

Recently, Chinese business registration information shows that Nantong Crystal Co., Ltd. (“Nantong Crystal”) has undergone a shareholder change. SDIC Jixin—a fund under China Integrated Circuit Industry Investment Fund Phase III (Big Fund Phase III)—has been added as a new shareholder. Meanw...

2025-11-04

[News] Chinese Research Team Breaks Through Bottleneck in Power Semiconductor Packaging Materials

Recently, the New Energy Electrical Materials and Energy Storage Technology Cultivation Team from the School of Mechanical and Electrical Engineering at Xi’an University of Architecture and Technology proposed an innovative “molecular ordering design” strategy. Using this approach, the team de...

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