As fan-out panel-level packaging (FOPLP) gains traction among semiconductor leaders like TSMC, Japanese companies—long known for their materials expertise—are stepping into the spotlight as well. Resonac, according to Nikkei and its press release, has announced JOINT3, a joint development fra...

While TSMC, Samsung, and other semiconductor giants ramp up U.S. investments under the government’s reshoring push, chip equipment leader Applied Materials is taking a different stance. According to Wccftech and Investing.com, CFO Brice Hill noted at the Deutsche Bank Tech Conference that U.S. inc...

According to Nikkei, earnings among leading chipmaking equipment makers are beginning to diverge, shaped by weakening sales in China and rising demand for AI chips. The report highlights that the combined net profit of the top ten chipmaking equipment makers remained robust, rising about 40% to $...

Following peers ASML and Tokyo Electron signaling caution on 2026 prospects, U.S. chipmaking equipment leader Applied Materials forecast a drop in fourth-quarter revenue, blaming sluggish demand in China and choppy orders from customers rattled by tariff-driven uncertainty, according to Reuters. ...

With chipmaking tools at the center of the U.S.-China tech war, Chinese equipment maker Beijing E-town Semiconductor has sued U.S. giant Applied Materials for allegedly stealing trade secrets, seeking 99.99 million yuan ($13.9 million) in damages for violating China's Anti-Unfair Competition Law, ac...