According to the Korea Economic Daily. Samsung Electronics' HBM3 and packaging services have passed AMD's quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung's HBM3 and packaging services. These chips, which combine central processing units (CPUs), ...

Intel Corporation today announced that it has mutually agreed with Tower Semiconductor to terminate its previously disclosed agreement  to acquire Tower due to the inability to obtain in a timely manner the regulatory approvals required under the merger agreement, dated Feb. 15, 2022. In accordance...

Charlie Boyle, Vice President of NVIDIA's DGX Systems, recently addressed the issue of limited GPU production at the company. Boyle clarified that the current GPU shortage is not a result of NVIDIA misjudging demand or constraints in Taiwan Semiconductor Manufacturing Company's (TSMC) wafer produ...

According to the latest report from TrendForce, the primary factors influencing the global market share of notebook CPUs in 2024 can be categorized into "Architectural Design" and "Economic Factors." "Architectural Design" as a long-term factor affecting market share: (1) Both AMD (AMD 3D V-Ca...

The surge in AIGC and new technologies such IoT, AI, 5G, AR/VR are driving a huge demand for computational power of high-end chips. This has been even outpacing the performance increase offered by the long-standing Moore's Law, ushering in a "post-Moore" era where revolutions in advanced chip design...