Subject


AMD


2023-08-31

Understanding Chiplets, SoC, and SiP: Why TSMC, Intel, Samsung Invest?

Semiconductor process technology is nearing the boundaries of known physics. In order to continually enhance processor performance, the integration of small chips (chiplets) and heterogeneous Integration has become a prevailing trend. It is also regarded as a primary solution for extending Moore's L...

2023-08-23

[News] TSMC Faces Capacity Shortage, Samsung May Provide Advanced Packaging and HBM Services to AMD

According to the Korea Economic Daily. Samsung Electronics' HBM3 and packaging services have passed AMD's quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung's HBM3 and packaging services. These chips, which combine central processing units (CPUs), ...

2023-08-16

Intel Cancels Tower Semiconductor Deal: TrendForce Analyzes Impact on Competitive Foundry Landscap

Intel Corporation today announced that it has mutually agreed with Tower Semiconductor to terminate its previously disclosed agreement  to acquire Tower due to the inability to obtain in a timely manner the regulatory approvals required under the merger agreement, dated Feb. 15, 2022. In accordance...

2023-08-09

AI GPU Bottleneck Explained: Causes and Prospects for Resolution

Charlie Boyle, Vice President of NVIDIA's DGX Systems, recently addressed the issue of limited GPU production at the company. Boyle clarified that the current GPU shortage is not a result of NVIDIA misjudging demand or constraints in Taiwan Semiconductor Manufacturing Company's (TSMC) wafer produ...

2023-08-07

TrendForce’s Analysis of Notebook CPU Market 2022-2024

According to the latest report from TrendForce, the primary factors influencing the global market share of notebook CPUs in 2024 can be categorized into "Architectural Design" and "Economic Factors." "Architectural Design" as a long-term factor affecting market share: (1) Both AMD (AMD 3D V-Ca...

  • Page 24
  • 28 page(s)
  • 138 result(s)

Get in touch with us