In a bid to catch up with leading players like TSMC, the South Korean government is said to have approved a national-level initiative aimed at actively promoting the development of advanced chip packaging technologies, according to a report from South Korean media outlet TheElec. Citing anonymou...

Per a report from TechNews, during Intel's earnings call last week, CEO Pat Gelsinger stated that the supply of Core Ultra processors in the second quarter is limited due to insufficient wafer-level assembly capacity. Gelsinger mentioned in the meeting that with the increasing demand for AI PCs ...

Amid NVIDIA's leadership in the AI wave, demand for CoWoS (Chip-on-Wafer-on-Substrate) has tripled, driving TSMC to aggressively expand CoWoS capacity, with a corresponding surge in demand for System-in-Integrated-Circuit (SoIC) solutions. According to a report from MoneyDJ citing industry source...

According to a report from South Korean media outlet TheElec, Samsung's Advanced Package (AVP) team has reportedly secured an advanced packaging order for NVIDIA's AI chip, paving the way for future supply of NVIDIA's high-bandwidth memory (HBM) chips. The report, citing sources, reveals that Sa...

SK Hynix is rumored planning to build an advanced packaging fab worth USD 4 billion in West Lafayette, Indiana. According to a report from The Wall Street Journal, it is expected to commence operations by 2028, creating up to 1,000 job opportunities. This initiative may receive support in the for...