With high demand for AI chips from major players like NVIDIA and AMD, the capacity for advanced packaging falls short of meeting demand. Industry sources cited in a report from the Economic Daily News indicate that TSMC's new CoWoS facility in the Southern Taiwan Science Park in Chiayi is now underg...

With the flourishing of AI applications, two major AI giants, NVIDIA and AMD, are fully committed to the high-performance computing (HPC) market. It's reported by the Economic Daily News that they have secured TSMC's advanced packaging capacity for CoWoS and SoIC packaging through this year and the ...

Powerchip Semiconductor Manufacturing Corporation (PSMC) held the inauguration ceremony for its new Tongluo plant on May 2nd. This investment project, totaling over NTD 300 billion  for a 12-inch fab, has completed the installation of its initial equipment and commenced trial production. According ...

The demand for AI computing power is skyrocketing, with advanced packaging capacity becoming key. As per a report from Commercial Times citing industry sources, it has pointed out that TSMC is focusing on the growth potential of advanced packaging. Southern Taiwan Science Park, Central Taiwan Sci...

In a bid to catch up with leading players like TSMC, the South Korean government is said to have approved a national-level initiative aimed at actively promoting the development of advanced chip packaging technologies, according to a report from South Korean media outlet TheElec. Citing anonymou...