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    • ACM Research

    News

    2024-08-13

    [News] ACM Research Steps into FOPLP Advanced Packaging Field

    Semiconductors

    Amid the advancement of emerging applications such as Artificial Intelligence (AI), High-Performance Computing (HPC), data center, and autonomous vehicle, fan-out panel-level packaging (FOPLP) technology has successfully garnered industry attention due to its advantages in significantly improving co...

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