While the rapid expansion of major Chinese memory players has drawn growing market attention, Reuters reports that more than half of the equipment used in one of the new fabs may have been sourced from domestic suppliers, including key systems for vertical chip-layer stacking. If confirmed, this cou...

As China’s top memory firms race to advance next-gen DRAM and NAND, domestic chip equipment makers are stepping up for a slice of the booming HBM market as well. According to ijiwei, ACM Research has introduced several solutions optimized for HBM production and plans to release HBM4-compatible cle...

Hanmi Semiconductor Forms HBM4 Equipment R&D Team Recently, Hanmi Semiconductor officially announced the establishment of a dedicated team focused on the development of HBM4-related equipment. On May 14, the company launched the “TC Bonder 4,” specifically designed for HBM4 production....

Recently, three leading Chinese semiconductor equipment manufacturers—AMEC (Advanced Micro-Fabrication Equipment Inc.), NAURA Technology Group, and ACM Research—released their latest 2024 financial forecasts and updates on new equipment developments. From revenue and profit changes to R&D...

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...