As China’s top memory firms race to advance next-gen DRAM and NAND, domestic chip equipment makers are stepping up for a slice of the booming HBM market as well. According to ijiwei, ACM Research has introduced several solutions optimized for HBM production and plans to release HBM4-compatible cle...

Hanmi Semiconductor Forms HBM4 Equipment R&D Team Recently, Hanmi Semiconductor officially announced the establishment of a dedicated team focused on the development of HBM4-related equipment. On May 14, the company launched the “TC Bonder 4,” specifically designed for HBM4 production....

Recently, three leading Chinese semiconductor equipment manufacturers—AMEC (Advanced Micro-Fabrication Equipment Inc.), NAURA Technology Group, and ACM Research—released their latest 2024 financial forecasts and updates on new equipment developments. From revenue and profit changes to R&D...

ACM Research, Inc., a provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications in China, announced on September 3rd the release of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This new tool is de...

Amid the advancement of emerging applications such as Artificial Intelligence (AI), High-Performance Computing (HPC), data center, and autonomous vehicle, fan-out panel-level packaging (FOPLP) technology has successfully garnered industry attention due to its advantages in significantly improving co...