According to ETNews, Intel’s U.S. headquarters reportedly told the outlet that there has been no change to the company’s glass substrate development plan outlined in its 2023 roadmap. In response to speculation that it might cut staff as part of an exit from the business, Intel stated it does no...

According to TrendForce's latest memory spot price trend report, regarding DRAM, suppliers continue to raise DDR4 quotes, encouraged by Nanya’s strong August revenue, but buyers show limited acceptance of the hikes. In NAND, SanDisk’s push for a 10% increase to lift market sentiment has met resi...

Despite the U.S. easing export restrictions to China for chip design software in early July, EDA heavyweight Synopsys is feeling the strain. The company reported third-quarter earnings below expectations, attributing the shortfall to a slowdown in its Design IP segment and difficulties faced by a ma...

According to Liberty Times, TSMC Vice President of Advanced Packaging Technology and Service Jun He said demand for the company’s advanced packaging services is booming, with customers pressing closely. In response, TSMC is working to shorten timelines and accelerate capacity. He also stressed tha...

Apple, at the September 9 launch event, has unveiled its full iPhone 17 lineup, introducing the Air model for the first time. Powering these devices are the company’s latest in-house silicon, including new smartphone APs, modem and networking chips. Here’s a quick overview of the new chips revea...