The shortage of advanced packaging production capacity is anticipated to end earlier than expected. Industry suggests that Samsung’s inclusion in providing HBM3 production capacity has led to an increased supply of memory essential for advanced packaging. Coupled with TSMC's strategy of enhancing ...

According to Economic Daily News' report, after a prolonged period of economy downturn, the market has gradually become optimistic about memories. The effective production reduction by the top five memory manufacturers has led to an increase in memory prices. This, in turn, has prompted downstre...

According to TechNews' report, in the midst of production cutbacks by Samsung, SK Hynix, and Micron, NAND Flash wafer prices are surging. As the traditional peak season for end-user stockpiling comes to an end, memory module manufacturers wish to position themselves favorably during a dip in dema...

Nvidia CFO, Colette Kress, recently hinted again that the next-gen chips might be outsourced to Intel Corp. During the call with semiconductor analyst Tim Arcuri at the UBS Global Technology Conference on November 28th, she was asked whether Intel would be considered as a foundry partner for the nex...

According to ChinaTimes' report, Intel's strides in European chip manufacturing are narrowing the gap with TSMC. The Fab 34 in Ireland has taken a significant step in production using EUV for the first time, with Intel 4 technology equivalent to the original 7nm. The research firm IC Knowledge ha...