Another breakthrough has emerged in flash memory layer technology! A recent report cited by tom’s Hardware has suggested that at the upcoming International Solid-State Circuits Conference (ISSCC) in February of this year, Samsung Electronics will unveil the next-generation V9 QLC NAND solution, pu...

Japanese telecommunications operator NTT is reportedly collaborating with American chipmaker Intel and other semiconductor manufacturers to research large-scale production of next-generation semiconductor technology, which involves significantly reducing power consumption using optical technology. ...

With the highly anticipated opening of TSMC's Kumamoto fab on February 24th, 2024, multiple Japanese or global semiconductor manufacturers are set to begin large-scale production in newly established plants in Japan. According to sources cited by TechNews, this development will stimulate the gro...

Since the release of the Huawei Mate 60 series smartphones, the Huawei Kirin chipset has been making a comeback with various iterations, including the Kirin 9000s and Kirin 9000E featured in the Mate 60 series. The latest update has revealed the confirmation of a new Kirin chipset named Kirin 9000W...

Amid the AI trend, the significance of high-value-added DRAM represented by HBM continues to grow. HBM (High Bandwidth Memory) is a type of graphics DDR memory that boasts advantages such as high bandwidth, high capacity, low latency, and low power consumption compared to traditional DRAM chips. ...