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2024-06-17

[News] With Memory Market Recovering, Kioxia Has Reportedly Ceased Production Cuts and Secured Bank Lending

According to a report from Nikkei, Japanese memory manufacturer Kioxia has ended production cuts amidst a recovery in the memory market and has secured new bank credit support. The company's plants in Yokkaichi, Mie Prefecture, and Kitakami, Iwate Prefecture, have restored their production lines to ...

2024-06-17

[News] Samsung Adopts Dimensity 9300+ Instead of Snapdragon, the First Time for Its Flagship Tablet to Feature MediaTek AP

According to a report by the Korean media outlet The Chosun Daily on June 16th, Samsung's "Galaxy Tab S10" series tablets will be equipped with MediaTek's Dimensity 9300+ application processor (AP) from Taiwan, marking the first instance of MediaTek's AP being adopted by Samsung's flagship tablet. ...

2024-06-17

[News] Samsung Plans to Introduce 3D HBM Chip Packaging Service in 2024

In 2023, Samsung disclosed plans to launch its advanced three-dimensional (3D) chip packaging technology, which would be able to integrate memory and processors needed for high-performance chips, in much smaller sizes. Now, at the Samsung Foundry Forum in San Jose taken place in June, the tech giant...

2024-06-17

[News] CoWoS Booming, TSMC Price Hikes Reportedly Imminent

Taiwan's semiconductor giant, TSMC, faces overwhelming demand for its 3nm technology, with major clients like Apple and NVIDIA fully allocate its production capacity. According to a report from Commercial Times, orders are expected to be filled through 2026. Reportedly, TSMC is planning to raise ...

2024-06-17

[News] X-Epic Develops EDA Tool for Application in Huawei Kunpeng Ecosystem

One major challenge for China's IC design industry is the lack of advanced domestic Electronic Design Automation (EDA) tools. Due to US export controls, suppliers like Cadence and Synopsys are unable to provide chip design software to China. Additionally, the absence of domestic EDA tools capable ...

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