According to TrendForce's latest memory spot price trend report, regarding DRAM, rumors about a delay in Samsung’s DDR4 EOL plan have been circulating. While TrendForce finds these claims inaccurate, they have nonetheless dampened the upward price momentum. Meanwhile, NAND flash demand remains cau...

While local media spotlight Huawei's push to cut China's HBM dependency for AI inference, the tech giant made waves on August 12th with the launch of UCM (Unified Computing Memory)—an AI inference breakthrough that slashes latency and costs while turbocharing efficiency, according to mydrivers and...

According to ZDNet, Samsung Electronics is developing System-on-Panel (SoP), an advanced semiconductor packaging technology. The report notes that if SoP advances quickly, Samsung could secure a role in Tesla’s next-generation Dojo packaging supply chain. At present, Tesla plans to have its “AI6...

After announcing in early July plans to wind down its Gallium Nitride (GaN) wafer foundry services by July 31, 2027, TSMC has now confirmed—following yesterday’s board meeting—that it will also phase out 6-inch wafer production within two years and further consolidate 8-inch capacity to improv...

Gallium Nitride (GaN) has emerged as a major growth engine in the power electronics market. With superior material properties, GaN offers unique advantages in high-frequency, high-efficiency, and compact power applications, driving multiple industry segments into a new wave of technological transfor...