Apple’s first foldable device remains highly anticipated, with new details continuing to surface. According to South Korean outlet The Elec, Apple is reviewing the use of transparent polyimide (PI) film as the protective layer placed on top of the ultra-thin glass (UTG) cover window for its debut ...

As conventional HBM designs continue to face thermal and stacking limits, major semiconductor players are exploring innovative memory architectures. In early February, Intel, in collaboration with SoftBank’s subsidiary SAIMEMORY, showcased a prototype of Z-Angle Memory (ZAM). Meanwhile, ZDNet repo...

As TSMC upgrades its second Kumamoto fab to 3nm, Japan’s homegrown foundry Rapidus is also drawing market attention. Hokkaido Shimbun reports IBM is backing the effort, planning a new office in downtown Chitose this spring to support Rapidus’ next-gen chip ambitions. IBM maintains a close par...

Could 7-inch large-screen smartphones make a comeback? According to Leikeji, sources say two handset makers are currently testing 7-inch large-screen phones. Although it remains unclear whether these devices will ultimately be launched, the move appears to tap into a segment of latent consumer deman...

While memory titans vie for HBM4 contracts with NVIDIA, another front in the memory race is heating up. According to TechPowerUp, SK hynix and Samsung are preparing to showcase their next-generation LPDDR6 memory at ISSCC 2026 in San Francisco, taking place from February 15–19. The report notes...