As China races to localize AI chips and memory, rumors are mounting that Washington may tighten controls on its HBM production. According to Chinese media outlet EE Times China, Hanmi Semiconductor has informed Chinese clients it will halt shipments of TC bonders, crucial tools for stacking HBM chip...

Nintendo’s next-generation console, the Switch 2, recently had its motherboard revealed and is slated for global release on June 5. According to Commercial Times, the device’s supply chain has attracted significant attention, with several Taiwanese tech companies involved. As noted by CNBC, N...

On May 12, the U.S. and China announced a 90-day tariff reduction, cutting U.S. duties on Chinese goods from 145% to 30%. According to Economic Daily News, the move is expected to ease pressure on major contract manufacturers with significant operations in China, including Foxconn, Compal, Quanta, I...

With 2nm becoming the next battleground for chipmakers, Samsung is racing—like Intel—to close the gap with TSMC by landing major external orders. Now, it may be just one step away: according to Chosun Biz, Samsung Foundry has entered the final phase of 2nm performance testing with NVIDIA GPUs an...

According to The Verge, citing Bloomberg, Apple is reportedly planning to launch an iPhone with an “almost all-glass, curved design” in 2027, coinciding with the 20th anniversary of the iPhone. The Verge also notes that this potential product may be linked to an earlier report from The Inform...