As reported by Reuters, citing sources, NVIDIA recently placed a 300,000-unit order for H20 with TSMC, reversing its earlier plan to rely solely on existing inventory due to strong demand from China. Economic Daily News highlights that this substantial order reflects continued robust demand from Chi...

According to South Korean media outlet The Korea Economic Daily, Samsung is reportedly considering further investment in its Taylor, Texas plant. Specifically, the company is said to be reviewing the addition of an advanced packaging line alongside its foundry and R&D facilities. The report n...

According to TrendForce's latest memory spot price trend report, regarding DRAM, trading activities have slowed down for DDR4 products compared with the previous week, while x16 consumer DRAM products have stronger price support compared with x8 PC DRAM products. As for NAND flash, some of the buyer...

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips directly onto PCB mainboards via mSAP processes, skipping IC substrates entirely. However, Info...

As per Reuters, sources state that Sony Group plans to sell its communication chip subsidiary, Sony Semiconductor Israel, in a deal valued at approximately USD 300 million. This move is part of Sony’s broader asset restructuring strategy aimed at further focusing on its core entertainment business...