Backed by the Japanese government, Rapidus is pushing toward 2nm mass production by 2027 as it seeks to close the gap with global foundry leaders. Despite this ambitious roadmap, the company’s financial position remains somewhat opaque, drawing market scrutiny. Notably, according to financial d...

Intel is collaborating with SoftBank’s subsidiary SAIMEMORY to advance a potential alternative to conventional high-bandwidth memory (HBM). According to TechPowerUp, SAIMEMORY plans to present a paper at VLSI Symposium 2026 in June, detailing its newly developed HB3DM memory based on Z-Angle Memor...

Riding an AI-driven semiconductor supercycle, Samsung’s Device Solutions (DS) division delivered a historic first quarter, with operating profit surpassing KRW 50 trillion for the first time, according to The Chosun Daily. The report highlights the unit’s overwhelming dominance, accounting for 9...

On April 28, Lightelligence—often described as the world’s first publicly listed AI silicon photonics chip listed company—debuted on the Hong Kong Stock Exchange. The company issued 13,795,215 shares at HKD 183.2 each, raising HKD 2.53 billion. Net proceeds came to HKD 2.38 billion after li...

As glass substrates gain traction as a key material for next-generation AI semiconductor packaging, related technologies are drawing increasing industry attention. According to ETNews, Chonnam National University said a research team led by Professor Han Seung-hoe from the Department of Mechanical E...