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2026-06-10

[Insights] Memory Spot Price Update: DDR5 Spot Momentum Continues as DDR4 Tightness Spills Over to DDR3

According to TrendForce’s latest memory spot price trend report, in terms of DRAM, demand for DDR5 is especially strong, while tight supply and persistently high DDR4 prices are pushing some buyers to downgrade to DDR3—lifting DDR3 prices as well. In the NAND flash segment, spot prices have stab...

2026-06-10

[News] Samsung May Announce New Gwangju Advanced Packaging Base by End-June Amid Capacity Expansion

Samsung Electronics is reportedly looking to expand its advanced packaging capacity. According to Hankyung, sources say the company is pursuing plans to build an advanced packaging plant in Gwangju. Samsung Electronics is expected to announce the investment as early as the end of this month at a mee...

2026-06-10

[News] Taiwan Reportedly Mulls Tighter AI Chip Export Rules on China Beyond Huawei, Raising Risks for Server Makers

As Washington continues to tighten restrictions on AI chip exports to China and related entities, its allies are also considering similar steps. According to Bloomberg, Taiwan is weighing significantly stricter controls on AI chip shipments to China in a move to further align with US measures. Th...

2026-06-10

[News] Amazon Signed Multibillion-Dollar Fiber Optics Supply Agreement With Corning

As investment in AI computing infrastructure continues to accelerate, demand for high-speed optical connectivity in data centers is growing by leaps and bounds. On June 8, Amazon and Corning jointly announced a multiyear, multibillion-dollar agreement under which Corning will supply optical fiber, c...

2026-06-10

[News] China’s Prinano Claims 8-inch Photonic Chip Mass Production Using Nanoimprint Tech, Bypassing DUV Lithography

While China continues efforts to produce advanced chips without access to ASML’s EUV tools, it is also pushing to reduce reliance on DUV systems. According to the South China Morning Post, Chinese start-up Prinano claims it has validated mass production of photonic chips on 8-inch silicon wafers u...

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