China’s chip equipment sector is accelerating its push for greater self-reliance. According to Newsswitch, the country has been a key driver of global semiconductor investment in recent years and is now moving to localize critical technologies long dependent on overseas suppliers, including lithog...

Japan has long been strong in semiconductor materials, and some unexpected players are now entering the field. According to Nikkei, Oji Holdings plans to launch a materials business targeting chips at 2nm and beyond. The company has developed a photoresist made using wood-based components, with comm...

Apple’s first foldable device remains highly anticipated, with new details continuing to surface. According to South Korean outlet The Elec, Apple is reviewing the use of transparent polyimide (PI) film as the protective layer placed on top of the ultra-thin glass (UTG) cover window for its debut ...

As conventional HBM designs continue to face thermal and stacking limits, major semiconductor players are exploring innovative memory architectures. In early February, Intel, in collaboration with SoftBank’s subsidiary SAIMEMORY, showcased a prototype of Z-Angle Memory (ZAM). Meanwhile, ZDNet repo...

As TSMC upgrades its second Kumamoto fab to 3nm, Japan’s homegrown foundry Rapidus is also drawing market attention. Hokkaido Shimbun reports IBM is backing the effort, planning a new office in downtown Chitose this spring to support Rapidus’ next-gen chip ambitions. IBM maintains a close par...