TSMC Chairman C.C.Wei, as reported by the Economic Daily News, reaffirmed at the shareholders’ meeting in early June that a CoPoS (Chip-on-Panel-on-Substrate) pilot line is already in place, with mass production expected in 2–3 years—keeping the company’s panel-level packaging push in focus....

On June 4, HP officially launched the limited-edition Ferrari AI PC. The device is the result of nearly two years of close collaboration, combining Ferrari’s design philosophy with HP’s industrial design expertise and precision engineering capabilities. Each unit carries an individual number ...

The AI era is creating a historic opportunity for the upgrade of high-speed, short-reach optical interconnects. According to the latest forecast from TrendForce, the market value of Micro LED-based co-packaged optics (CPO) transceiver modules is projected to reach USD 848 million by 2030. Against th...

TSMC continues to accelerate its advanced packaging capacity expansion, helping move the industry closer to supply-demand balance. According to Economic Daily News, institutional investors said that as TSMC and its partners aggressively build out new advanced packaging capacity, the CoWoS supply-dem...

Rapidly rising AI data center power consumption is accelerating adoption of 800V high-voltage direct current (HVDC) architectures. According to Commercial Times, NVIDIA's Vera Rubin platform and Google's next-generation AI data centers are reportedly among the first to adopt the technology, driving ...