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2026-02-26

[News] Samsung Reportedly Ends Last 2D NAND Line as Early as March, Repurposes Facility for 1C DRAM

Amid tightening memory supply, cutting MLC NAND output is becoming a clear trend among major memory makers—but Samsung’s 2D NAND era could end sooner than expected. According to The Elec, the company may halt 2D NAND production at Hwaseong Line 12 as early as March and converting the facility in...

2026-02-26

[News] SK hynix & Sandisk Kick Off Global Standardization of HBF, Market Set to Surge by 2030

As the AI industry shifts from model training toward inference — existing memory architectures are increasingly reaching their limits, positioning HBF (High Bandwidth Flash) as a key next-generation solution. Marking a major step forward, SK hynix and Sandisk jointly hosted the “HBF Spec. Standa...

2026-02-26

[News] Memory Giants’ HBM Cleanroom Race: Samsung & SK hynix Fast-Track, Micron Acquires

Amid soaring memory demand and aggressive product roadmaps from NVIDIA and other big techs, memory giants are racing not just on chip performance but also on cleanroom capacity, each taking a different approach. Financial News reports that Samsung and SK hynix are fast-tracking cleanroom constructio...

2026-02-26

[News] China’s Chip Materials Drive Intensifies as Photoresist Leader Red Avenue Seeks Hong Kong IPO

China’s semiconductor push is moving deeper into critical photoresist materials, spotlighting emerging domestic champions. According to ijiwei, Red Avenue New Material Group (RAChem) filed for listing on the Hong Kong Stock Exchange on February 13. As the report highlights, in the first nine month...

2026-02-25

[News] Xiaomi Doubles Down on Chips; Trademark Filing Reportedly Signals Potential Memory Entry

Xiaomi is stepping up its chip ambitions. According to South China Morning Post, the company is reinforcing its five-year investment plan focused on core technologies such as semiconductors, AI, and operating systems, as it positions itself as a deep-tech force in China’s self-reliance push. Le...

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