With Samsung’s major strike scheduled to begin on May 21, the memory giant has already moved to implement pre-emptive measures to limit potential losses. According to The Financial News and Newspim, the company is curbing the intake of new wafers into production lines while reshaping its product m...

Amid China’s semiconductor push, SMIC has remained a key player, with its earnings closely watched by the industry. According to The Wall Street Journal, SMIC posted a 5% increase in first-quarter net profit, missing analysts’ expectations. The report notes that net profit totaled US$197.4 mill...

Riding sustained AI-driven demand across both logic and memory, Applied Materials has struck a more bullish tone for 2026, projecting over 30% growth in its semiconductor equipment business and more than 50% growth in packaging revenue, according to Reuters. The outlook marks a notable upgrade fr...

Shortly after Denso withdrew its bid for Rohm in late April, the spotlight has shifted back to the proposed three-way power semiconductor alliance involving Rohm, Toshiba Device & Storage, and Mitsubishi Electric. But according to Nikkei xTECH, citing Rohm president Katsumi Azuma, negotiations a...

Samsung Electronics is reportedly developing a next-generation HBM packaging technology aimed at bringing high-performance on-device AI to mobile devices. According to ETNews, sources say the company is working on a “Multi Stacked FOWLP” technology that combines ultra-high-aspect-ratio copper pi...