While TSMC recently revealed that its upcoming A13 and A12 processes, both targeted for 2029, are not expected to require High-NA EUV lithography, ASML says the first chips produced using the technology may arrive soon. According to Reuters, ASML CEO Christophe Fouquet said the company expects to se...

As Intel gains traction with its 18A and 14A nodes, its advanced packaging business — particularly EMIB (Embedded Multi-die Interconnect Bridge) — is also drawing customer support amid tight substrate supply. Speaking at the J.P. Morgan Global Technology Conference, Intel CEO Lip-Bu Tan said sev...

Shanghai AI Laboratory announced a breakthrough in the stable production of photoresists — one of the core materials used in semiconductor manufacturing. As a critical material in chip fabrication, the quality of photoresists directly determines chip performance and manufacturing yield. Backed ...

Intel’s turnaround appears to be gaining momentum. According to CNBC, Intel CEO Lip-Bu Tan said the company’s foundry business is making progress, with 18A process yields now improving by 7% to 8% per month, signaling advancement from earlier challenges. More significantly, Tan said the impro...

As AI accelerator leaders such as NVIDIA continue rolling out chips with increasingly larger compute die sizes, panel-level packaging is gaining momentum. Notably, Germany-headquartered SCHMID — an equipment provider for printed circuit board (PCB) and IC substrate manufacturing — said in an Inv...