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2026-05-04

[News] Micron Says AI Still in Early Stage as Memory Demand Reportedly Seen Exceeding 50% of Total Market This Year

Micron Technology CEO Sanjay Mehrotra said the memory supply crunch is only beginning as AI demand continues to grow. According to Wccftech, citing an interview with CNBC, he noted that AI remains in its early stages and that ongoing advances will require not only faster but also greater amounts of ...

2026-05-04

[News] Kioxia, SanDisk to Demonstrate QLC NAND Using Multi-Stacked Cell Architecture, Targeting 1,000+ Layers

As memory makers accelerate migration toward ~300-layer class NAND, Kioxia and SanDisk are reportedly pushing further ahead. According to EE Times Japan, the companies have achieved a world-first demonstration of quad-level cell (QLC) operation using a multi-stacked cell array CMOS (MSA-CBA) archite...

2026-05-04

[News] Samsung, SK hynix Deepen LTAs as Buyers Pay Premiums to Secure Supply, May Drive Memory Prices Higher

Memory Makers’ push to expand long-term contracts is reshaping memory market dynamics, with potential implications for pricing. According to Fnnews, citing analysts, the broader use of long-term supply agreements (LTAs) by Samsung Electronics may, paradoxically, drive prices higher and introduce a...

2026-05-04

[News] Intel’s EMIB Reportedly Gains Traction at Google, Meta; Yields Said to Reach ~90% Milestone

Intel’s leading-edge nodes, spearheaded by 18A, are gradually building momentum, while its advanced packaging portfolio is also showing clear traction. According to Wccftech, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) has reached 90% yield levels, with Google and Meta Platforms emergi...

2026-05-04

[News] China Unveils First GaN Magnetic Encoder Chip for Humanoid Robot Joints

Recently, CT-Unite released its CT-21X gallium nitride (GaN) magnetic encoder chip, marking the debut of China’s first GaN-based encoder specifically designed for humanoid robot joints. The launch represents a key breakthrough in the country’s development of high-end, application-specific chips ...

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