According to a report by Taiwan's Commercial Times, JPMorgan's latest analysis reveals that AI demand will remain robust in the second half of the year. Encouragingly, TSMC's CoWoS capacity expansion progress is set to exceed expectations, with production capacity projected to reach 28,000 to 30,000...

According to a report by Taiwan's Economic Daily, Foxconn Group has achieved another triumph in its AI endeavors. The company has secured orders for over 50% of NVIDIA's HGX GPU base boards, marking the first instance of such an achievement. Adding to this success, Foxconn had previously acquired a...

According to the news from Commercial Times, in a recent press conference, the four major American cloud service providers (CSPs) collectively expressed their intention to expand their investment in AI application services. Simultaneously, they are continuing to enhance their cloud infrastructure. A...

Looking at the impact of AI server development on the PCB industry, mainstream AI servers, compared to general servers, incorporate 4 to 8 GPUs. Due to the need for high-frequency and high-speed data transmission, the number of PCB layers increases, and there's an upgrade in the adoption of CCL grad...

AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, "HBM and 2.5D Packaging: the Essential Backbone Behind AI Server," we discovered that th...