According to a report by Taiwan's Money DJ, there's good news from TSMC regarding its 3nm node. Sources within the supply chain have disclosed that the number of new chip designs using the 3nm process, known as "New Tape-Outs" (NTOs), has surged. It's confirmed that customers including MediaTek, AMD...

According to a report by Taiwan's Economic Daily, TSMC is aggressively expanding its advanced packaging capacity. Recently, they placed an additional 30% order for equipment with manufacturers, leading to a doubling of order volumes for companies in the interposer supply chain, such as UMC and ASE G...

According to a report by Taiwan's Economic Daily, TSMC's CoWoS advanced packaging capacity is running at full throttle. As they actively expand their production capabilities, there are reports of major customers like NVIDIA increasing their orders for AI chips. Additionally, industry giants like AMD...

Source to China Times, the International Semiconductor Industry Association (SEMI) forecasts that from 2023 to 2026, the global semiconductor industry will add 12 new 8-inch wafer fabs, with 8-inch fab monthly production capacity increasing by 14% to a historic high of 7.7 million wafers. In respons...

The competitive advantage of automotive GaN components is becoming increasingly prominent. Leveraging their exceptional material characteristics, SiC components are rapidly making inroads into sectors such as automotive, renewable energy, and power PFC. Similarly, GaN components are excelling in ...