As TSMC and Intel slow down their plans for building fabs in the United States, the supply chain, according to a report from Nikkei Asia, is also said to delay in following suit, with semiconductor material suppliers like Topco Scientific, LCY Chemical, and Chang Chun Group among those named. Per...

Driven by the AI chip wave, "advanced packaging" emerges as the hottest technology in the semiconductor industry. Its significance extends beyond computational power demands, as the escalating cost of semiconductor processes and the limits of Moore's Law make the "integration capability" of advanced...

The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible. According to a report from TechNe...

In 2022, Intel engaged in negotiations with the Italian government, planning to invest USD 5 billion in constructing a packaging and testing facility. This project would also receive subsidies from the Italian government, expected to cover 40% of the construction costs, along with additional subsidi...

Chip giant NVIDIA kicked off its annual Graphics Processing Unit (GPU) Technology Conference (GTC) today, with CEO Jensen Huang announcing the launch of the new artificial intelligence chip, Blackwell B200. According to a report from TechNews, this new architecture, Blackwell, boasts a massive GP...