Orders for thermal compression (TC) bonders from South Korean semiconductor equipment manufacturers are experiencing a surge, fueled by Samsung Electronics and SK Hynix ramping up their high-bandwidth memory (HBM) production. TC bonders play a pivotal role in HBM production by employing thermal comp...

On June 21, ASE Group announced that ASE Semiconductor will collaborate with Hung Ching Construction to build a K28 plant in Kaohsiung. The project is expected to be completed in the fourth quarter of 2026 and will focus on end testing of advanced packaging processes, and high-performance computing ...

According to a report from Reuters, it’s rumored that ByteDance, the parent company of TikTok, is collaborating with American chip designer Broadcom to develop an advanced AI processor, which could provide ByteDance with a steady supply of high-end chips. On June 24th, Reuters’ report cited s...

According to a report by Korean media outlet Business Korea, SK Hynix recently shared its latest breakthrough on its 3D DRAM at VLSI 2024 last week, announcing that the manufacturing yield of its 5-layer stacked 3D DRAM has reached 56.1%. This means that out of roughly 1,000 3D DRAM units manu...

According to a report from Korean media outlet ZDNet Korea, the yield rate for Samsung Electronics' latest Exynos 2500 processor has improved to slightly below 20% from single digits in the first quarter. However, the current yield rate is still said to be falling short of mass production standards...