According to Commercial Times, citing Japanese media outlet TBS News, the construction of TSMC’s second fab in Kumamoto has reportedly been delayed, with the groundbreaking date pushed back from the originally planned "first quarter of 2025" to "sometime within 2025." However, the plant’s pro...

Shortly after confirming positive progress on its 18A node, with tape-outs set for 1H25, Intel also updated on its adoption of high-NA EUV equipment. On Monday, the company revealed that the first two high-NA EUV machines from ASML are in production, processing 30,000 wafers in a quarter already, as...

Recently, the semiconductor industry has seen two major developments, as the EU and Japan have each announced substantial subsidies for semiconductor-related companies to promote local industry growth. Infineon Receives €920 Million EU Subsidy, Dresden Plant Accelerates Development On Februa...

According to Chosun Biz, citing a report published by the Korea Institute of Science and Technology Evaluation and Planning (KISTEP), as of last year, China has surpassed South Korea in foundational capabilities across all technology sectors, with the exception of advanced packaging. Even in the ...

As memory giants fiercely compete to push the limits of NAND technology, a surprising twist has emerged: Samsung is reportedly set to use a hybrid bonding patent from China’s YMTC, starting with its V10 (10th generation) NAND, according to the latest ZDNet report. The report indicates that Sams...