Subject


Semiconductors


2024-08-23

[News] GUC’s HBM4 IP Ready, But CSP Adoption Timing Unclear

HBM4, the sixth generation of HBM, is poised to become the key to breakthroughs in computing power for next-generation CSPs (Cloud Service Providers). According to a report from Commercial Times citing Global Unichip Corp. (GUC), to support the development of HBM4, their semiconductor IP (Intellectu...

2024-08-23

[News] HBM Technological Battle to be on the Next Level

Per a report by BusinessKorea, SK hynix Vice President Ryu Seong-su announced the company's strategic plan in the HBM field during the SK Group Icheon Forum 2024 held on August 19. SK hynix plans to develop a product that boasts dozen of times the performance of existing HBM technologies. The r...

2024-08-23

[News] Samsung and SK hynix’s China Revenue Doubled in 1H24, Reportedly Driven by Semiconductor and HBM Demand

Earlier in July, ASML CEO Christophe Fouquet noted that though China’s progress on cutting-edge chips is ten years behind the U.S., the world is in need of the legacy chips it manufactured. Now it seems that in order to become “the world’s factory,” China has to turn itself into “the world...

2024-08-22

[News] Micron Advances in Acquiring Innolux’s Southern Taiwan Facility After TSMC Outbids It for the G5.5 Plant

According to a report from TechNews, after Innolux shut down its 5.5-generation plant last year, it initially planned to sell the facility to memory giant Micron. However, TSMC successfully acquired Innolux’s 4th Plant in Tainan and its associated facilities, with a transaction value of NTD 17.14 ...

2024-08-22

[News] Rapidus Reportedly Pursues JPY 100 Billion in Bank Financing for Mass Production

As per a report from Kyodo News on August 21st, that the Japan-based chip manufacturer Rapidus is expected to begin mass production of 2nm chips by 2027. To secure the necessary funds for semiconductor production, Rapidus is reportedly seeking JPY 100 billion in financing from banks. Reportedly, ...

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