Subject


Semiconductors


2024-08-28

[News] SK hynix Reportedly to Tape-out HBM4 in October, Paving the Way for NVIDIA’s Rubin

In mid-August, Samsung is said to be accelerating its progress on next-gen HBM, targeting to tape-out HBM4 by the end of this year. Now it seems SK hynix has maintained its competitive edge, as the company aims to tape out HBM4 in October, which will be used to power NVIDIA's Rubin AI chips, accordi...

2024-08-27

[News] Xiaomi Reportedly to Launch In-House Processor in 2025, Manufactured with TSMC’s 4nm

According to a report from wccftech,  previous claims about Xiaomi abandoning the development of its smartphone processor due to high costs were incorrect. Instead, Xiaomi is expected to release its custom solution in the first half of 2025, with its performance rumored to be equivalent to Qualco...

2024-08-27

[News] Chinese Rivals Said to Recruit Samsung’s Advanced Packaging Business Leader after the Unit Disbanded

Amid the AI boom driving a surge in demand for advanced packaging, Samsung Electronics announced in March its ambition to achieve record-high revenue for the business this year, aiming to surpass the USD 100 million mark. The company, which is eager to catch up with TSMC not only on the foundry bu...

2024-08-27

[News] Kioxia’s IPO Paves the Way for SK Hynix to Secure Funds for HBM Investment

Kioxia has moved forward with its plans to go public, starting the process on August 23. This development follows Bain Capital, a U.S. private equity firm with a majority stake in Kioxia, submitting an application for the listing to the Tokyo Stock Exchange on the same day, according to Nikkei. K...

2024-08-27

[News] Applied Materials Receives Subpoena from U.S. Department of Justice, Faces Further Scrutiny

According to a report from Bloomberg, Applied Materials Inc. pointed out that the U.S. Department of Justice (DOJ) has requested information regarding its federal grant applications, further intensifying the government's investigation into the company's operations. Per a regulatory filing last we...

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