Samsung has been working hard to pass NVIDIA’s qualification test for its 12-layer HBM3E. However, even if successful, the company is unlikely to see significant short-term revenue, according to a report from Deal Site. While Samsung may complete the qualification later this year, the report notes...

As the public comment window for the U.S. Section 232 semiconductor probe closed in early May, tension simmered across the chip industry—many feared that the lack of public response could increase the chances of steep tariffs. But according to data released by the Bureau of Industry and Security o...

On May 20, Qualcomm announced that it has signed a new multi-year cooperation agreement with Xiaomi, marking a new phase in their deepening collaboration — extending from smartphones to a comprehensive smart ecosystem. Under the agreement, Xiaomi’s flagship smartphones will continue to be pow...

As HBM4 has become the next battle ground for memory giants, Samsung seems to be aiming to close its gap with SK hynix through aggressive investment. According to ZDNet, Samsung plans to expand 1c DRAM (6th-gen 10nm-class) production in both Hwaseong and Pyeongtaek, with investments starting by year...

According to SEMI’s latest report, global semiconductor capital expenditures (CapEx) fell 7% quarter-over-quarter in Q1 2025 but rose 27% year-over-year, driven by sustained investments in advanced logic, high-bandwidth memory (HBM), and advanced packaging technologies that support AI applications...