Chinese equipment supplier Zhongwei Precision Instrument has announced a major advance in silicon carbide (SiC) substrate manufacturing, becoming the first to achieve mass production of 8-inch SiC laser lift-off technology with total material loss reduced to the 40μm range. The milestone breaks ...

For years, China’s semiconductor push has been driven by state-backed capital and nationwide efforts to overcome technological bottlenecks. However, according to OFWeek, the country’s chip race is no longer solely government-led, as major companies increasingly pursue semiconductor development t...

As Lam Research announced the establishment of its Panel-Level Packaging Center of Excellence (CoE) in Salzburg, Austria, attention has turned to its customer and partner ecosystem. According to EE Times Japan, Yasumitsu Orii, head of Rapidus’ engineering center, delivered a congratulatory vide...

As global CSPs accelerate efforts to reduce reliance on NVIDIA through custom silicon, ASICs are gaining momentum across the industry, supporting growth prospects for partners such as Alchip. According to Commercial Times, during Alchip’s earnings call on the 26th, Chairman Johnny Shen said that ...

Intel’s glass substrate ambitions appear to be moving closer to commercialization, with speculation growing over the location of its first volume production facility. According to Forbes, Rio Rancho, New Mexico, could become not only Intel’s first site for volume glass substrate manufacturing, b...