According to FETV, Samsung has reportedly passed Broadcom’s qualification test for its HBM3E 8-Hi prototype, raising the prospect of rejoining the supply chain. Multiple testing equipment sources cited in the report indicate that its improved 8-Hi product has successfully passed the verification, ...

According to Bloomberg, the Senate’s draft tax bill proposes a temporary boost to the investment tax credit for semiconductor manufacturers—raising it from 25% to 30% of plant investments. The measure is aimed at encouraging chipmakers to ramp up spending on new facilities before the credit expi...

Backed by founder Ren Zhengfei’s belief that advanced packaging and stacking can keep China in the advanced chip race, Huawei has reportedly filed a patent for a quad-chiplet design—likely linked to its next-gen AI chip, the Ascend 910D, per Tom’s Hardware. The report suggests that it could...

As artificial intelligence (AI) and high-performance computing (HPC) enjoy burgeoning growth, chip power consumption is highly on the rise—making heat dissipation a critical bottleneck limiting performance and reliability. On June 13, U.S.-based Coherent announced the launch of its breakthrough di...

As AI chip giants like NVIDIA and AMD race ahead with next-gen HBM adoption, SK hynix is reportedly taking a more cautious stance on the investment in 1c DRAM (6th-gen 10nm-class), according to South Korean media outlet the bell. The move reflects the company’s strategy to double down on the more ...