Just as semiconductor veteran Lip-Bu Tan steps in as Intel’s CEO, the company’s 18A node seems to be making early strides. TechPowerUp, citing Intel’s engineering manager Pankaj Marria, reports that initial 18A wafers are already rolling out from the Arizona plant. The progress, according t...

As Samsung advances HBM3E validation with key clients like NVIDIA, it is also targeting the next-gen mobile DRAM market. According to The Bell, the company is developing Low Power Wide I/O (LPW) DRAM with multiple partners, including Apple, to meet the growing demand for on-device AI. The Bell in...

According to a report from TechNews, industry sources suggest that China may issue its first official guidelines as early as this month to promote the nationwide adoption of open-source RISC-V chips. This initiative aims to accelerate efforts to reduce reliance on Western technology. RISC-V is an...

According to TechNews, citing Tom’s Hardware, a research team from China's Peking University has developed the world’s first two-dimensional, low-power GAAFET transistor. Their findings have been published in Nature. The team claimed that their transistor is the fastest and most efficient av...

According to a report from Commercial Times, citing Yonhap News, China’s “Old-for-New” Policy, which promotes consumer trade-ins for new products, helped drive significant growth for South Korean semiconductor companies, Samsung Electronics and SK Hynix, in the Chinese market in 2024. Meanw...