Nearly a month after rumors surfaced about an imminent bankruptcy, a clearer picture has emerged: Wolfspeed is now on the verge of a major shake-up. Creditors led by Apollo Global Management are preparing to take control under a bankruptcy plan, according to Reuters, citing Bloomberg. The reports...

In the ongoing race within the semiconductor industry, TSMC and Samsung Electronics are fiercely competing to lead in 2nm chip manufacturing. As per recent reports, both companies plan to begin mass production of 2nm chips in 2H25. However, TSMC is at an advantage in securing orders due to its super...

According to TrendForce's latest memory spot price trend report, regarding DRAM, SK hynix and Micron are currently in last-time buy negotiations with DDR4 customers, pushing spot prices higher as contract prices are set to rise in Q3 2025. As for NAND flash, recent market rumors on China’s stern a...

NVIDIA still leads in the AI chip race, but its global AI infrastructure push recently may reflect concerns that hardware growth may slow—and that CSPs ramping up ASIC development could become serious challengers. According to Commercial Times, as Google, Microsoft, and Meta ramp up in-house ASIC ...

According to Economic Daily News, fan-out panel-level packaging (FOPLP) is regarded as the next mainstream technology in advanced packaging. Key industry players—including foundry giant TSMC, semiconductor packaging and testing leader ASE, and memory packaging powerhouse Powertech—are actively i...