As AI, HPC, and heterogeneous integration architectures gain rapid adoption, TSMC is accelerating adjustments to its manufacturing plans. According to Commercial Times, industry sources say TSMC is evaluating a reallocation of part of its 40nm–90nm mature-node capacity, which could be redirected t...

While upstream memory makers continue to lift prices as supply tightens and demand surges, the impact is now cascading into the testing and packaging segment. According to the Economic Daily News, major Taiwanese memory OSAT providers — led by Micron’s key partner Powertech Technology — have r...

China International Development Corporation Limited (CIDC), a leather apparel-focused company, and Bowei Limited, a wholly owned subsidiary of LONTEN Semiconductor, signed a strategic cooperation memorandum of understanding on January 6, 2026, announcing plans to jointly establish an advanced power ...

As China accelerates its push for domestic chips, Iluvatar CoreX has emerged as a new focus of industry attention following its recent listing in Hong Kong. According to ijiwei, the company disclosed that it will unveil the road map for its next three product generations on January 26, covering area...

At CES 2026, NVIDIA takes the lead with its next-generation Rubin, positioning itself as the initial, exclusive HBM4 client currently. While the AI chip giant is certainly reshaping the HBM4 landscape, TrendForce observes it has pushed per-pin speeds above 11 Gbps, forcing SK hynix, Samsung, and M...