While TSMC plans to exit the gallium nitride (GaN) wafer foundry business by 2027, industry heavyweight Infineon is ramping up its efforts. Leveraging its strong IDM model, Infineon, according to its press release, is advancing its scalable GaN production on 300mm wafers, with first customer samples...

According to Bloomberg, sources say the U.S. Commerce Department is drafting new rules to restrict shipments of advanced AI chips to Malaysia and Thailand, as part of a broader effort to crack down on suspected chip smuggling into China. As noted by Tom’s Hardware, citing Bloomberg, a prelimina...

As UMC looks beyond mature nodes to drive growth, Economic Daily News suggests that the Taiwanese foundry has landed a major advanced packaging order from Qualcomm. Its self-developed high-end interposer has passed Qualcomm’s verification and is now nearing mass production, the report adds. UMC...

The advancement of glass substrate technology has drawn significant attention across the semiconductor industry. According to a report from ETNews, industry sources on July 3 noted that Absolics—a subsidiary of SKC—is ramping up its production of glass substrates. ETNews highlights that this mov...

While Intel has shifted focus to 14A from 18A in a strategic trade-off, Samsung has reportedly made its compromises by prioritizing on 2nm and 4nm instead of 1.4nm, as per ZDNet. Meanwhile, Chosun Biz reveals that the struggling semiconductor giant also plans to boost demand in sub-7nm processes—s...