Subject


Semiconductors


2025-07-15

[News] LG Makes Bold Move in HBM Race with Hybrid Bonders, Reportedly Sets Sights by 2028

As Samsung and SK hynix charge ahead in the HBM race, an unexpected player is said to be entering the arena from a different angle. LG Electronics is reportedly making a bold push into the semiconductor equipment space by developing hybrid bonders for HBM, according to Sedaily. Sedaily suggests a...

2025-07-14

[News] Japan Reportedly Demands Golden Share in Rapidus as Condition for JPY 100 Billion Investment

According to a report from MoneyDJ, citing NHK, Japan’s Ministry of Economy, Trade and Industry (METI) is considering additional investment in domestic foundry Rapidus. As a condition, the government is reportedly planning to require a “golden share” in the company—a special type of share th...

2025-07-14

[News] Broadcom Reportedly Scraps $1 Billion Chip Investment in Spain

According to a report from Alerta, citing Europa Press, sources state that Broadcom has scrapped its plan of building a microchip manufacturing plant in Spain, promoted under Spain’s Strategic Project for Economic Recovery and Transformation (PERTE Chip) The company announced in the summer of 2...

2025-07-14

[News] Intel on the Move: Nova Lake Reportedly Tapes Out on TSMC’s 2nm, with 18A Yields Gaining Speed

Despite challenges from massive layoffs, Intel is showing promising progress with its next-gen flagship processor and 18A yields. According to TechPowerUp and SemiAccurate, Intel’s “Nova Lake-S” client CPU has reportedly taped out at TSMC’s 2nm fab in Taiwan. The reports reveal Intel tape...

2025-07-14

[News] Intel Raises Oregon Layoffs to 2,400; Reportedly to Cut 4,000 Nationwide by Mid-July

According to Oregon Live, Intel’s mass layoffs escalated significantly Friday evening, as the company revealed plans to cut nearly 2,400 jobs in Oregon, almost five times more than previously disclosed. Earlier in the week, Intel informed Oregon state officials of plans to lay off more than 500...

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