According to The Korea Economic Daily, sources indicate that Samsung Electronics will invest 25 billion yen (about $170 million) to establish an advanced chip packaging research and development center in Yokohama, Japan. The report adds that the City of Yokohama, which announced Samsung’s R&D ...

With its China-focused H20 still facing uncertainty despite U.S. approval, NVIDIA’s next-gen AI chip Rubin has drawn fresh attention amid delay rumors. But the company told Barron’s and Seeking Alpha the claims are false, adding Rubin remains on schedule. The reports, citing Fubon Research, w...

According to TechNews, citing TechPowerUp and Wccftech, Apple’s next-generation M5 chips—set to be used in new MacBook Pro models launching in 2026—will reportedly feature a major upgrade in packaging technology, adopting LMC (Liquid Molding Compound) exclusively supplied by Taiwan’s Eternal...

As Chinese local media revealed Micron begun layoffs in its China operations as of August 11, a latest report from South China Morning Post discloses that the move is expected to affect hundreds of employees, as part of its global pullback from the underperforming mobile NAND market. The layoffs ...

While Micron boosted its Q4 FY2025 revenue forecast to $11.2 billion on August 12, ZDNet and New Daily report that the company has unexpectedly become the first of the big three memory giants to hint at a full sell-out of its 2026 HBM supply. In contrast, HBM leader SK hynix has yet to make a simila...