Ahead of NVIDIA’s GTC next week, all eyes are on the HBM4 supply for its next-gen AI accelerator, Vera Rubin, set for release in the second half of the year. Hankyung, citing industry sources, reports that Samsung Electronics and SK hynix are on the component supplier list. With HBM4 production ta...

In recent years, restrictions on China’s access to NVIDIA’s high-end chips have tightened; however, these curbs have in turn created unprecedented growth opportunities for domestic chipmakers. According to 21jingji, Chinese chip design companies have reported rising revenue, with firms such as ...

Riding the semiconductor surge, traditional industries are racing to pivot into the booming sector. South Korea’s paint giant, Samhwa Paint Industries, announced on March 6 that, in partnership with Samsung SDI, it has successfully developed high-performance MMB (Melt Master Batch), a key material...

China has been accelerating its push for semiconductor self-reliance amid U.S. restrictions, and a new article written by the country’s leading chip executives has outlined a strategic roadmap. According to South China Morning Post, top figures in China’s semiconductor industry co-authored the p...

Major semiconductor companies are reportedly considering easing thickness standards for next-generation HBM, as future generations such as HBM4E and HBM5 are expected to adopt 20-layer stacking. According to ZDNet, while the current HBM4 thickness standard is 775 micrometers (μm), industry discussi...