Subject


NAND Flash


2026-03-04

[News] Asia’s Chipmakers Reportedly Eye $136B Spend in 2026, Up 25% YoY, Spanning Foundry and Memory

NAND Flash

Fueled by soaring demand for AI chips, memory, and logic processors, Asia’s top chipmakers are ramping up their 2026 capital spending. Nikkei and TrendForce report that leading semiconductor firms across South Korea, Taiwan, Japan, and China plan to invest over $136 billion this year, a 25% increa...

2026-03-02

[News] Taiwan’s Phison Reportedly Follows Key Suppliers with New Prepayment Policy

NAND Flash

Following the lead of major NAND players like Sandisk, Taiwanese NAND Flash controller maker Phison Technology informed customers in late February of updated payment terms, requiring either prepayment or shorter payment cycles, according to Commercial Times and ijiwei. The company, according to t...

2026-02-26

[News] Samsung Reportedly Ends Last 2D NAND Line as Early as March, Repurposes Facility for 1C DRAM

NAND Flash

Amid tightening memory supply, cutting MLC NAND output is becoming a clear trend among major memory makers—but Samsung’s 2D NAND era could end sooner than expected. According to The Elec, the company may halt 2D NAND production at Hwaseong Line 12 as early as March and converting the facility in...

2026-02-26

[News] SK hynix & Sandisk Kick Off Global Standardization of HBF, Market Set to Surge by 2030

NAND Flash

As the AI industry shifts from model training toward inference — existing memory architectures are increasingly reaching their limits, positioning HBF (High Bandwidth Flash) as a key next-generation solution. Marking a major step forward, SK hynix and Sandisk jointly hosted the “HBF Spec. Standa...

2026-02-12

[News] SK hynix Unveils AI Chip Architecture with HBF, Reportedly Boosts Performance per Watt by Up to 2.69×

NAND Flash

SK hynix has unveiled a new semiconductor architecture concept centered on High Bandwidth Flash (HBF), a memory technology that stacks multiple NAND flash dies. According to Hankyung, the company recently outlined the concept—dubbed “H3”—in a paper presented at the Institute of Electrical an...

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