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IC Manufacturing, Package&Test


2024-11-29

[News] U.S. Reportedly to Unveil Chip Restrictions Next Week, Impacting Samsung, SK hynix, and Micron

IC Manufacturing, Package&Test

Rumors have been circulating that the Biden administration might announce new export restrictions targeting China around Thanksgiving. Now more details have surfaced, as a report from Bloomberg indicates that additional restrictions on the sale of semiconductor equipment and AI memory chips to China...

2024-11-29

[News] TSMC on Track to Qualify Ultra-Large CoWoS with 9x Reticle Sizes, 12 HBM4 Stacks by 2027

IC Manufacturing, Package&Test

According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large chip-on-wafer-on-substrate (CoWoS) packaging technology would be certified by 2027, featuring 9x reticle sizes and supporting up to 12 stacks of HBM...

2024-11-28

[News] Cisco Reportedly Bans Chinese-Origin Products as U.S. Tightens Chip Rules, Micron Poised to Benefit

IC Manufacturing, Package&Test

Following the footsteps of PC makers such as Dell and HP, which reportedly aim to reduce the number of components made in China as quickly as possible, a report by technowvoice suggests that American networking giant Cisco is also joining the ranks, as it has now prohibited suppliers from providing ...

2024-11-28

[News] Intel’s USD 7.86 Billion Subsidy Deal under CHIPS Act Reportedly Limits Foundry Stake Sale

IC Manufacturing, Package&Test

Intel has finally secured the USD 7.86 billion in direct funding under the U.S. CHIPS Act a couple of days ago. However, there is a premise: the company would not be allowed to sell its stake in the chipmaking unit at will, according to the latest report from Reuters. The report notes that the de...

2024-11-28

[News] Samsung Cuts Photoresist Usage in 3D NAND Production, Boosting Cost Efficiency

IC Manufacturing, Package&Test

Samsung has significantly reduced the amount of photoresist (PR) used during the photolithography process in its 3D NAND flash production, according to a report by The Elec. Citing industry sources, The Elec revealed that the Samsung has halved the volume of PR used in the production of its advan...

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