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IC Manufacturing, Package&Test


2025-01-03

[News] MediaTek’s Dimensity 9500 Might Use TSMC’s N3P instead of 2nm, Giving Samsung an Advantage

IC Manufacturing, Package&Test

Following MediaTek’s launch of its flagship mobile processor, Dimensity 9400, more details about the Taiwanese IC design firm’s next hit, the Dimensity 9500, have already surfaced. According to South Korea media outlet SamMobile, the chipset is likely to be manufactured using TSMC’s N3P node, ...

2025-01-03

[News] Semiconductor Foundry Competition Intensifies: Japan and South Korea Step Up

IC Manufacturing, Package&Test

Although the demand in the consumer electronics market has yet to recover, the rise of artificial intelligence and flagship smartphones is driving sustained growth in advanced semiconductor manufacturing. The semiconductor foundry industry remains dynamic, with global research firm TrendForce foreca...

2025-01-02

[News] Chinese Foundry Giant Hua Hong Appoints Former Intel VP as New President

IC Manufacturing, Package&Test

As 2025 unfolds, a personnel shake-up has taken place in Hua Hong Semiconductor, China’s second largest foundry. According to the company’s announcement and a report from Chinese media outlet ICsmart, it has named Peng Bai, former global vice president of Intel, as the new president, effective f...

2025-01-02

[News] TSMC to Lose 2nm Orders? NVIDIA and Qualcomm Reportedly Mull to Team up with Samsung

IC Manufacturing, Package&Test

With rumors indicating that Apple, one of TSMC’s most critical customers, may delay the adoption of the foundry giant’s 2nm process until 2026, a Commercial Times report, citing Chosun Daily and SamMobile, now suggests that NVIDIA and Qualcomm are following suit, as they are reportedly mulling t...

2025-01-01

[News] TSMC Sets Up 2nm Pilot Line, Aims for 130,000 Wafers Monthly by 2026

IC Manufacturing, Package&Test

TSMC's next-generation 2nm development is actively progressing. According to MoneyDJ, industry sources indicate that TSMC has begun setting up a pilot production line for 2nm (N2) at its Hsinchu Baoshan fab (Fab 20) this quarter, with a planned monthly capacity of approximately 3,000 to 3,500 wafers...

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