Subject


IC Manufacturing, Package&Test


2025-01-10

[News] NVIDIA’s GB10 Superchip Powering Project DIGITS is Reportedly Built with TSMC’s 3nm Node

IC Manufacturing, Package&Test

NVIDIA stole the show at CES 2025, as CEO Jensen Huang showcased a compact personal AI supercomputer called Project DIGITS, powered by the company’s GB10 Grace Blackwell Superchip. According to Commercial Times and the Economic Daily News, TSMC plays a significant role in the product as well, as t...

2025-01-09

[News] Rapidus to Begin 2nm Test Production in April, Success Critical for Securing Investments

IC Manufacturing, Package&Test

Rapidus is building its facility in Chitose City, Hokkaido, with the aim of mass-producing 2nm chips by 2027. According to a Nikkei report, the company’s 2nm test production will start in April 2025, just a few months away. This test production is highlighted as a pivotal milestone for Rapidus, as...

2025-01-08

[News] Multiple 12-inch Wafer Lines in China Officially Commissioned!

IC Manufacturing, Package&Test

12-inch wafer fabs play a crucial role in semiconductor manufacturing. By the end of 2024, several major projects have made headlines. Production has commenced for five 12-inch wafer lines from Runpeng Semiconductor, Tiancheng Advanced, Yandong Microelectronics, Guangzhou Chip Semiconductor, and Hua...

2025-01-06

[News] Samsung Reportedly Starts Trial Production of HBM4 Logic Die with In-house 4nm, Challenging SK hynix

IC Manufacturing, Package&Test

Samsung’s turnaround in the DRAM sector certainly hinges on its progress of next-gen HBMs, and now there is a ray of hope. According to South Korean media outlet the Chosun Daily, the company has started trial production of the logic dies used in HBM4. More importantly, it has kicked off initial p...

2025-01-03

[News] MediaTek’s Dimensity 9500 Might Use TSMC’s N3P instead of 2nm, Giving Samsung an Advantage

IC Manufacturing, Package&Test

Following MediaTek’s launch of its flagship mobile processor, Dimensity 9400, more details about the Taiwanese IC design firm’s next hit, the Dimensity 9500, have already surfaced. According to South Korea media outlet SamMobile, the chipset is likely to be manufactured using TSMC’s N3P node, ...

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