Subject


IC Manufacturing, Package&Test


2024-07-03

[News] HBM and Advanced Packaging Expected to Benefit Silicon Wafer

IC Manufacturing, Package&Test

As artificial intelligence (AI) technology enjoys rapid advances, the demand for AI chips is skyrocketing, driving continuous improvements in advanced packaging and HBM (High Bandwidth Memory) technology, which is expected to benefit the silicon wafer industry. Recently, Doris Hsu, the Chairperso...

2024-07-03

[News] Chip War Escalates: China to Enforce State Ownership of All Rare Earth Materials in October

IC Manufacturing, Package&Test

The chip war between the U.S. and China keeps escalating, as China’s new regulation would reportedly take effect soon. This time it has a new target - rare-earth materials. According to the reports from Nikkei and Tom’s Hardware, the new regulation would be effective on October 1, asserting stat...

2024-07-02

[News] Taiwan Reportedly to Accommodate up to 20 More Large Plants Due to Power Constraints

IC Manufacturing, Package&Test

As semiconductor companies led by TSMC accelerate their pace for capacity expansion, benefiting the local supply chain, industry electricity consumption has emerged as a tough challenge for Taiwan. According to the latest report by the Economic Daily News, Taiwan can only accommodate 20 more large p...

2024-07-01

[News] TSMC Achieved a New Step in the Construction of its Third 2nm Fab

IC Manufacturing, Package&Test

Recently, TSMC reportedly got approval for the land change and environmental assessment of its third 2nm plant in Kaohsiung. It is reported that the Nanzih Industrial Park in Kaohsiung City will adapt to the changing needs of the global semiconductor industry supply chain and will carry out the d...

2024-06-27

[News] Samsung Refutes Rumors Regarding 3nm Wafer Defects as Groundless

IC Manufacturing, Package&Test

Rumors have been circulating regarding Samsung’s 3nm yield recently. The latest market speculation on June 25th alleged that Samsung’s foundry plant encountered a defect impacting 2,500 lots in the 3nm second-generation process, reportedly leading to a loss of 1 trillion won (USD 720 million), a...

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