Samsung, the Korean tech giant, has unveiled SAINT technology to counter TSMC's advanced CoWoS packaging, aiming to benefit from the surging AI market. Market reports reveal that Samsung is strategically procuring a substantial amount of 2.5D packaging equipment, indicating a keen awareness of the s...

The AI landscape witnesses a robust surge with the consecutive launches of AMD's "Instinct MI300" series AI chips and NVIDIA's upcoming "B100" GPU structure. This wave of innovation propels a flourishing demand for AI-related Outsourced Semiconductor Assembly And Test Services (OSAT), surpassing in...

According to TechNews' report, Apple, NVIDIA, AMD, Qualcomm, and MediaTek all utilize TSMC's semiconductor processes for manufacturing their latest chips, with some potentially employing Samsung's foundry, though typically not for flagship products. With Samsung's improved yield rates in recent m...

Equipment is playing an indispensable role during the wafer manufacturing process. In response to market needs, the global EUV lithography supplier, ASML, has recently taken significant steps. ASML's Bold Move: Annual Investment of EUR 100 Million in Berlin Plant As reported by the German med...

According to TechNews’ report, there are recent rumors indicating that AMD's next-generation chip, with the Zen5C architecture codenamed "Prometheus," will adopt a "Dual Foundry Mode." This means it will simultaneously utilize TSMC's 3nm and Samsung's 4nm processes. This move suggests that AMD aim...