According to Taiwan's Economic Daily News, UMC has recently engaged in discussions with global giants such as Texas Instruments and Infineon about long-term cooperation plans. Additionally, Taiwan’s two leading IC design companies, MediaTek and Realtek, have seen their inventories of WiFi 6/6E chi...

This May, we have witnessed two different approaches to the new High-NA EUV (high-numerical aperture extreme ultraviolet) lithography equipment between semiconductor giants. Intel has secured the first batch of High-NA EUV kits from ASML, which will allegedly be used on its 18A (1.8nm) and 14A (1.4n...

Belgium-based IMEC Microelectronics Research Center has announced the leading role in establishing the NanoIC pilot line project, for which it has received a total of EUR 2.5 billion from public and corporate donations. As one of the four advanced semiconductor pilot line projects designated by t...

As the demands for AI and HPC processors keep their momentum, driving the usage of advanced packaging technologies, TSMC revealed plans to further expand its chip-on-wafer-on-substrate (CoWoS) capacity at a compound annual rate (CAGR) of over 60% until at least 2026, according to a report by AnandTe...

According to reports from Korean news outlet FN News and Wccftech, aiming to win back NVDIA as a major customer, Samsung has made it a priority to secure chip order from the GPU heavyweight this year. To achieve this, Samsung is reportedly doing everything possible to ensure the company’s 3nm proc...